Structure and formation method of chip package with antenna element

ABSTRACT

Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and a first protective layer surrounding the semiconductor die. The chip package also includes a second protective layer over the semiconductor die and the first protective layer. The chip package further includes an antenna element over the second protective layer. The antenna element is electrically connected to the conductive element of the semiconductor die.

PRIORITY CLAIM AND CROSS-REFERENCE

This Application claims the benefit of U.S. Provisional Application No.62/433,436, filed on Dec. 13, 2016, the entirety of which isincorporated by reference herein.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as personal computers, cell phones, digital cameras, and otherelectronic equipment. The fabrication of the semiconductor devicesinvolves sequentially depositing insulating or dielectric layers,conductive layers, and semiconductor layers over a semiconductorsubstrate, and patterning the various material layers using lithographyand etching processes to form circuit components and elements on thesemiconductor substrate.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallows more components to be integrated into a given area. The number ofinput and output (I/O) connections is significantly increased. Smallerpackage structures, which utilize less area or have lower heights, aredeveloped to package the semiconductor devices.

New packaging technologies have been developed to improve the densityand functionality of semiconductor devices. These relatively new typesof packaging technologies for semiconductor devices face manufacturingchallenges.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It shouldbe noted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1A-1J are cross-sectional views of various stages of a process forforming a chip package, in accordance with some embodiments.

FIG. 2 is a cross-sectional view of a chip package, in accordance withsome embodiments.

FIG. 3 is a cross-sectional view of a chip package, in accordance withsome embodiments.

FIG. 4 is a cross-sectional view of a chip package, in accordance withsome embodiments.

FIGS. 5A-5J are cross-sectional views of various stages of a process forforming a chip package, in accordance with some embodiments.

FIGS. 6A-6E are cross-sectional views of various stages of a process forforming a chip package, in accordance with some embodiments.

FIGS. 7A-7D are cross-sectional views of various stages of a process forforming a chip package, in accordance with some embodiments.

FIGS. 8A-8C are cross-sectional views of various stages of a process forforming a chip package, in accordance with some embodiments.

FIG. 9 is a top view of an antenna element of a chip package, inaccordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Embodiments of the disclosure may be applied in 3D packaging or 3D ICdevices. Other features and processes may also be included. For example,testing structures may be included to aid in the verification testing ofthe 3D packaging or 3DIC devices. The testing structures may include,for example, test pads formed in a redistribution layer or on asubstrate that allows the testing of the 3D packaging or 3DIC, the useof probes and/or probe cards, and the like. The verification testing maybe performed on intermediate structures as well as the final structure.Additionally, the structures and methods disclosed herein may be used inconjunction with testing methodologies that incorporate intermediateverification of known good dies to increase the yield and decreasecosts.

Some embodiments of the disclosure are described. Additional operationscan be provided before, during, and/or after the stages described inthese embodiments. Some of the stages that are described can be replacedor eliminated for different embodiments. Additional features can beadded to the semiconductor device structure. Some of the featuresdescribed below can be replaced or eliminated for different embodiments.Although some embodiments are discussed with operations performed in aparticular order, these operations may be performed in another logicalorder.

FIGS. 1A-1J are cross-sectional views of various stages of a process forforming a chip package, in accordance with some embodiments. As shown inFIG. 1A, a passivation layer 102 is formed over a support substrate 100,in accordance with some embodiments. The support substrate 100 mayinclude a glass substrate, a semiconductor substrate, a metal substrate,an insulating substrate, one or more other suitable substrates, or acombination thereof.

The passivation layer 102 may be used to protect elements that will beformed over the passivation layer 102. In some embodiments, thepassivation layer 102 has a substantially planar top surface 102 a. Thepassivation layer 102 may be made of or include a polymer material. Thepolymer material may be made of or include polyimide, epoxy-based resin,polybenzoxazole (PBO), another suitable polymer material, or acombination thereof. In some other embodiments, the passivation layer102 is made of or includes silicon nitride, silicon oxide, siliconoxynitride, silicon carbide, another suitable dielectric material, or acombination thereof.

In some embodiments, the passivation layer 102 is formed using a spin-onprocess, a spray coating process, a chemical vapor deposition (CVD)process, a physical vapor deposition (PVD) process, another applicableprocess, or a combination thereof.

As shown in FIG. 1A, antenna elements 104 are formed over thepassivation layer 102, in accordance with some embodiments. The antennaelements 104 are used to receive and/or transmit electromagneticsignals. In some embodiments, because the antenna elements 104 areformed over the substantially planar top surface of the passivationlayer 102, the antenna elements 104 have substantially planar topsurfaces accordingly. Because the antenna elements 104 have low surfaceroughness, the performance of the antenna elements 104 is improved. Forexample, the skin effect of the antenna elements 104 is prevented orreduced.

FIG. 9 is a top view of an antenna element of a chip package, inaccordance with some embodiments. In some embodiments, FIG. 9 is the topview of the structure shown in FIG. 1A.

In some embodiments, there are multiple antenna elements includingantenna elements 104A-104F formed over the passivation layer 102, asshown in FIG. 9. In some embodiments, each of the antenna elements104A-104F includes multiple main portions 105A₁-105A₅ that are linkedtogether through linking portions 105B between these main portions105A₁-105A₅. In some embodiments, widths (or areas) of the main portions105A₁-105A₅ are different from each other. In some embodiments, the mainportion 105A₁ has a width W₁ that is greater than a width W₂ of the mainportion 105A₂ or a width W₄ of the main portion 105A₄. In someembodiments, the width W₂ of the main portion 105A₂ is greater than awidth W₃ of the main portion 105A₃. In some embodiments, the width W₄ ofthe main portion 105A₄ is greater than a width W₅ of the main portion105A₅. The sizes, shapes, and/or distributions of the antenna elements104 may be adjusted and/or modified according to requirements.

In some embodiments, the antenna elements 104 are made of or includeconductive materials. The antenna elements 104 may be made of or includecopper, gold, aluminum, titanium, tungsten, cobalt, nickel, platinum,another suitable material, or a combination thereof. In someembodiments, the antenna elements 104 are formed using an electroplatingprocess, an electroless plating process, a PVD process, a CVD process,another applicable process, or a combination thereof. One or morephotolithography processes and etching processes may be used to achievethe formation of the antenna elements 104.

As shown in FIG. 1B, one or more conductive features 106 are formed overthe antenna elements 104, in accordance with some embodiments. Theconductive features 106 may be used as through insulating vias (TIVs)that establish electrical connections between the antenna elements 104and semiconductor dies that will be disposed later.

In some embodiments, each of the conductive features 106 has a verticalsidewall that is substantially perpendicular to a main surface 100 a ofthe support substrate 100. In some embodiments, the conductive features106 are made of or include copper, aluminum, gold, platinum, titanium, asolder material, another suitable conductive material, or a combinationthereof. In some embodiments, the conductive features 106 are formedusing an electroplating process, an electroless plating process, a PVDprocess, a pin installation process, another applicable process, or acombination thereof. The formation of the conductive features 106 mayalso involve one or more photolithography processes and etchingprocesses.

As shown in FIG. 1C, a protective layer 108 is formed over the structureshown in FIG. 1B, in accordance with some embodiments. The protectivelayer 108 surrounds the antenna elements 104 and the conductive features106. In some embodiments, there is no semiconductor die formed and/orpositioned between the top surface and the bottom surface of theprotective layer 108.

In some embodiments, the protective layer 108 is made of or includes amolding compound material. The molding compound material may include anepoxy-based resin with fillers dispersed therein. The fillers mayinclude insulating fibers, insulating particles, other suitableelements, or a combination thereof. For example, the fillers include orare made of silicon oxide, silicon nitride, silicon carbide,carbon-containing polymer materials, other suitable materials, or acombination thereof. In some embodiments, the protective layer 108 isformed using a transfer molding process, a compression process, animmersion process, another applicable process, or a combination thereof.

In some embodiments, a planarization process is used to thin down theprotective layer 108 until the conductive features 106 are exposed. Theplanarization process may include a grinding process, a chemicalmechanical polishing (CMP) process, an etching process, anotherapplicable process, or a combination thereof. In some other embodiments,the planarization process is not performed. For example, the protectivelayer 108 is formed using a transfer molding process. By using thetransfer molding process, the top surfaces of the conductive features106 are not covered by the protective layer 108 during the formation ofthe protective layer 108. Therefore, it may be not necessary to performa planarization process to expose the conductive features 106.

In some embodiments, the antenna elements 104 are used to receive ortransmit electromagnetic signals that have a wavelength. In someembodiments, the protective layer 108 has a thickness that is in a rangefrom about 0.01 times the wavelength to about 0.25 times the wavelength.In some embodiments, the protective layer 108 has a thickness greaterthan 50 μm. In some other embodiments, the thickness of the protectivelayer 108 is in a range from about 10 μm to about 2500 μm.

As shown in FIG. 1D, a dielectric layer 110 is deposited over theprotective layer 108 and the conductive features 106, in accordance withsome embodiments. In some embodiments, the dielectric layer 110 ispatterned to form one or more openings that expose the conductivefeatures 106.

Afterwards, conductive elements including conductive elements 112 a, 112b, and 112 c are formed over the dielectric layer 110, as shown in FIG.1D in accordance with some embodiments. In some embodiments, theconductive element 112 a is electrically connected to one of the antennaelements 104 through one of the conductive features 106. In someembodiments, the conductive elements 112 b and 112 c are used asshielding elements. In some embodiments, the conductive elements 112 bor 112 c are electrically isolated from the conductive element 112 a. Insome embodiments, the conductive element 112 b or 112 c serving as ashielding element has a greater width than that of the antenna element104 directly below the conductive element 112 b or 112 c. In someembodiments, the shielding element is grounded after subsequent elementsare formed. The conductive element (shielding element) 112 b or 112 cmay be used to prevent undesired interactions between the antennaelements 104 and semiconductor dies that will be disposed later.

Many variations and/or modifications can be made to embodiments of thedisclosure. In some other embodiments, one of the conductive elements112 b and 112 c is not used as a shielding element and is electricallyconnected to one of the antenna elements 104 through one of theconductive features 106 (not shown in FIG. 1D).

In some embodiments, the conductive elements 112 a, 112 b, and 112 c aremade of or include copper, aluminum, gold, titanium, cobalt, platinum,tin, another suitable material, or a combination thereof. In someembodiments, the conductive elements 112 are formed using anelectroplating process, an electroless plating process, a PVD process, aCVD process, another applicable process, or a combination thereof. Theformation of the conductive elements 112 may also involve one or morephotolithography processes and etching processes.

As shown in FIG. 1E, conductive features 114 are formed over theconductive elements 112, in accordance with some embodiments. In someembodiments, the material and formation method of the conductivefeatures 114 are similar to or the same as those of the conductivefeatures 106. In some embodiments, one of the conductive features 114 iselectrically connected to the conductive element 112 a that iselectrically connected to one of the antenna elements 104. In someembodiments, one of the conductive features 114 is electricallyconnected to the conductive element 112 c that is used as a shieldingelement.

As shown in FIG. 1E, semiconductor dies 118A and 118B are placed overthe conductive elements 112 a, 112 b, and/or 112 c and the dielectriclayer 110, in accordance with some embodiments. In some embodiments, anadhesive film 116 is used to affix the semiconductor dies 118A and 118Bon the conductive elements 112 a, 112 b, and/or 112 c. Each of thesemiconductor dies 118A and 118B includes multiple conductive elements120, such as conductive pads. Each of the semiconductor dies 118A and118B may include a passivation layer 122 partially covering theconductive elements 120. In some embodiments, the semiconductor die 118Bincludes a radio-frequency integrated circuit (RFIC). In someembodiments, the semiconductor die 118A includes a micro-controller.

As shown in FIG. 1F, a protective layer 124 is formed over the structureshown in FIG. 1E, in accordance with some embodiments. The protectivelayer 124 surrounds the conductive features 114 and the semiconductordies 118A and 118B. In some embodiments, the protective layer 124 ismade of or includes a molding compound material. The molding compoundmaterial may include an epoxy-based resin with fillers dispersedtherein. In some embodiments, the protective layer 124 is formed using atransfer molding process, a compression process, an immersion process,another applicable process, or a combination thereof.

In some embodiments, a planarization process is used to thin down theprotective layer 124 until the conductive features 114 and theconductive elements 120 of the semiconductor dies 118A and 118B areexposed. The planarization process may include a grinding process, a CMPprocess, an etching process, another applicable process, or acombination thereof. In some other embodiments, the planarizationprocess is not performed. For example, the protective layer 124 isformed using a transfer molding process where the top surfaces of theconductive features 114 and the conductive elements 120 of thesemiconductor dies 118A and 118B are not covered by the protective layer124.

In some embodiments, the material of the protective layer 124 isdifferent from that of the protective layer 108. In some embodiments,the protective layer 108 has a lower dielectric constant than that ofthe protective layer 124. In some embodiments, the protective layer 108has a lower dissipation factor (DF) than that of the protective layer124.

As shown in FIG. 1G, an interconnection structure is formed over thestructure shown in FIG. 1F, in accordance with some embodiments. Theinterconnection structure includes multiple dielectric layers 126 andmultiple conductive features 128. The formation of the interconnectionstructure may include multiple deposition processes and patterningprocesses. After the interconnection structure is formed, electricalconnections between the semiconductor dies (such as the semiconductordie 118B) and one or more of the antenna elements 104 are formed. Insome embodiments, one of the conductive elements 120 of thesemiconductor die 118B is electrically connected to one of the antennaelements 104 through the conductive features 128 and 114, the conductiveelement 112, and the conductive feature 106. In some other embodiments,one of the conductive elements 120 of the semiconductor die 118B iselectrically connected to two or more of the antenna elements 104through the interconnection structure. In some other embodiments, two ormore of the conductive elements 120 of the semiconductor die 118B areelectrically connected to the antenna elements 104. For example, each ofthe conductive elements 120 of the semiconductor die 118B iselectrically connected to a corresponding one of the antenna elements104 through the interconnection structure. In some other embodiments,some of the conductive elements 120 of the semiconductor die 118B arenot electrically connected to the antenna elements 104. For example,some of the conductive elements 120 are electrically connected toanother semiconductor die (such as the semiconductor 118A) through theinterconnection structure.

As shown in FIG. 1H, conductive bumps 130 are formed over some of theconductive features 128, in accordance with some embodiments. In someembodiments, the conductive bumps 130 include solder bumps. The solderbumps are made of tin and other metal materials. The conductive bumps130 may include metal pillars such as copper pillars in someembodiments. Afterwards, surface mounting devices 132 are placed on someof the conductive features 128, as shown in FIG. 1H in accordance withsome embodiments. The surface mounting devices 132 may include passivedevices, such as capacitors, resistors, and/or inductors.

As shown in FIG. 1I, the structure shown in FIG. 1H is placed upsidedown and disposed on a tape frame 134, in accordance with someembodiments. Afterwards, the support substrate 100 is removed. In someembodiments, a dicing operation is performed to obtain multiple chippackages. However, embodiments of the disclosure are not limitedthereto. In some other embodiments, the support substrate 100 is notremoved.

Afterwards, the tape frame 134 is removed, as shown in FIG. 1J inaccordance with some embodiments, where one of the chip packages isshown.

In the embodiments as shown in FIG. 1J, the antenna elements 104 arestacked over the semiconductor dies 118B and 118A. Electricalconnections between the antenna elements 104 and the semiconductor dies118B and/or 118A are formed through vertical conductive features such asconductive features 106 and 114. In some other cases where antennaelements and the semiconductor die are disposed on the same plane (suchas on the same substrate), a relatively large area may be needed forforming the electrical connections therebetween. In some embodiments,because electrical connections between the antenna elements 104 and thesemiconductor die 118B and/or 118A occupy a relatively small area, thesize of the chip package may be reduced further. The antenna elements104 of the chip package may perform better. For example, lower signalloss and/or lower power dissipation may be achieved.

In the embodiments shown in FIG. 1J, the conductive features 114 and 106are not arranged in an aligned manner. In some embodiments, a directprojection of the conductive feature 114 on the top surface of theprotective layer 108 does not overlap a direct projection of theconductive feature 106 on the top surface of the protective layer 108.

Many variations and/or modifications can be made to embodiments of thedisclosure. FIG. 2 is a cross-sectional view of a chip package, inaccordance with some embodiments. FIG. 2 shows a chip package similar tothat shown in FIG. 1J. In some embodiments, the conductive feature 106is substantially aligned with the conductive feature 114, as shown inFIG. 2. In some embodiments, a direct projection of the conductivefeature 114 on the top surface of the protective layer 108 overlaps adirect projection of the conductive feature 106 on the top surface ofthe protective layer 108.

Many variations and/or modifications can be made to embodiments of thedisclosure. FIG. 3 is a cross-sectional view of a chip package, inaccordance with some embodiments. FIG. 3 shows a chip package similar tothat shown in FIG. 1J. In some embodiments, there is only onesemiconductor die (the semiconductor die 118A) disposed or positioned inthe protective layer 124.

Many variations and/or modifications can be made to embodiments of thedisclosure. FIG. 4 is a cross-sectional view of a chip package, inaccordance with some embodiments. FIG. 4 shows a chip package similar tothat shown in FIG. 2. In some embodiments, there is only onesemiconductor die (the semiconductor die 118A) formed or positioned inthe protective layer 124.

In the embodiments illustrated in FIGS. 1A-1J, the antenna elements areformed before using a protective layer to surround semiconductor dies.However, embodiments of the disclosure are not limited thereto. In someother embodiments, the antenna elements are formed after using aprotective layer to surround semiconductor dies.

FIGS. 5A-5J are cross-sectional views of various stages of a process forforming a chip package, in accordance with some embodiments. As shown inFIG. 5A, a dielectric layer 502 is formed over a support substrate 500,in accordance with some embodiments. The support substrate 500 may besimilar to or the same as the support substrate 100. The material andformation method of the dielectric layer 502 may be similar to or thesame as those of the dielectric layer 110.

Afterwards, multiple conductive elements including conductive elements504 a, 504 b, and 504 c are formed over the dielectric layer 502, asshown in FIG. 5A in accordance with some embodiments. The material andformation method of the conductive elements 504 a, 504 b, and 504 c maybe similar to or the same as those of the conductive elements 112 a, 112b, and 112 c.

Afterwards, conductive features 506 are formed over the conductiveelements (such as the conductive elements 504 a and 504 c), as shown inFIG. 5A in accordance with some embodiments. The material and formationmethod of the conductive features 506 may be similar to or the same asthose of the conductive features 114.

As shown in FIG. 5B, semiconductor dies 510A and 510B are placed overthe conductive elements 504 a, 504 b, and/or 504 c, in accordance withsome embodiments. In some embodiments, an adhesive film 508 is used toaffix the semiconductor dies 510A and 510B on the conductive elements504 a, 504 b, and/or 504 c. Each of the semiconductor dies 510A and 510Bincludes multiple conductive elements 512, such as conductive pads. Eachof the semiconductor dies 510A and 510B may include a passivation layer514 partially covering the conductive elements 512. In some embodiments,the semiconductor die 510A includes a radio-frequency integrated circuit(RFIC). In some embodiments, the semiconductor die 510B includes amicro-controller.

As shown in FIG. 5C, a protective layer 516 is formed over the structureshown in FIG. 5B, in accordance with some embodiments. The protectivelayer 516 surrounds the conductive features 506 and the semiconductordies 510A and 510B. The material and formation method of the protectivelayer 516 may be similar to or the same as those of the protective layer124.

In some embodiments, a planarization process is used to thin down theprotective layer 516 until the conductive features 506 and theconductive elements 512 of the semiconductor dies 510A and 510B areexposed. The planarization process may include a grinding process, a CMPprocess, an etching process, another applicable process, or acombination thereof. In some other embodiments, the planarizationprocess is not performed. For example, the protective layer 516 isformed using a transfer molding process where the top surfaces of theconductive features 506 and the conductive elements 512 of thesemiconductor dies 510A and 510B are not covered by the protective layer516.

As shown in FIG. 5D, an interconnection structure is formed over thestructure shown in FIG. 5C, in accordance with some embodiments. Theinterconnection structure includes multiple dielectric layers 518 andmultiple conductive features 520. The formation of the interconnectionstructure may include multiple deposition processes and patterningprocesses.

As shown in FIG. 5E, conductive bumps 522 are formed over some of theconductive features 520, in accordance with some embodiments. In someembodiments, the conductive bumps 522 include solder bumps. The solderbumps are made of tin and other metal materials. The conductive bumps522 may include metal pillars such as copper pillars. Afterwards,surface mounting devices 524 are placed on some of the conductivefeatures 520, as shown in FIG. 5E in accordance with some embodiments.The surface mounting devices 524 may include passive devices, such ascapacitors, resistors, and/or inductors.

As shown in FIG. 5F, the structure shown in FIG. 5E is placed upsidedown and disposed on a tape frame 526, in accordance with someembodiments. Afterwards, the support substrate 500 is removed.

As shown in FIG. 5G, a protective layer 528 is formed over thedielectric layer 502, in accordance with some embodiments. The materialand formation method of the protective layer 528 may be similar to orthe same as those of the protective layer 108. In some embodiments, theprotective layer 528 is an insulating film that is laminated or adheredon the dielectric layer 502. In some embodiments, the protective layer528 has a substantially planar top surface.

In some embodiments, the material of the protective layer 528 isdifferent from that of the protective layer 516. In some embodiments,the protective layer 528 has a lower dielectric constant than that ofthe protective layer 516. In some embodiments, the protective layer 528has a lower dissipation factor than that of the protective layer 516.

Afterwards, one or more openings 530 are formed to expose the conductiveelements including the conductive element 504 a, as shown in FIG. 5G inaccordance with some embodiments. In FIG. 5G, one of the openings 530 isshown. In some embodiments, the protective layer 528 and the dielectriclayer 502 are partially removed to form the openings 530. In someembodiments, the openings 530 are formed using a laser drilling process.In some other embodiments, the openings 530 are formed using aphotolithography process, an etching process, an energy beam drillingprocess, another applicable process, or a combination thereof.

As shown in FIG. 5H, a mask 532 (or a stencil) is placed over thestructure shown in FIG. 5G, in accordance with some embodiments. Themask 532 has openings that are used to define patterns of antennaelements that will be formed later. In some embodiments, the patternsare similar to the patterns shown in FIG. 9.

Afterwards, a squeegee 536 is used to move a conductive paste material534 into the openings of the mask 532, as shown in FIG. 5H in accordancewith some embodiments. Therefore, the conductive paste material 534 isprinted thereon. In some embodiments, the conductive paste material 534includes a copper-containing paste material, a gold-containing pastematerial, another suitable material, or a combination thereof.

As shown in FIG. 5I, a reflow process is performed on the conductivepaste material 534, in accordance with some embodiments. As a result,the conductive paste material 534 turns into conductive layers includinga conductive layer 538 that fills the openings 530. These conductivelayers form multiple antenna elements and conductive features. In someembodiments, the operation temperature of the reflow process is in arange from about 180 degrees C. to about 250 degrees C. In someembodiments, the operation time of the reflow process is in a range from30 minutes to about 2 hours.

The portion of the conductive layer 538 that fills one of the openings530 forms a conductive feature 538 b. The portion of the conductivelayer 538 over the protective layer 528 forms an antenna element 538 a.In some embodiments, the antenna element 538 a is electrically connectedto the conductive element 512 of the semiconductor die 510A through theconductive feature 538 b, the conductive element 504 a, and theconductive feature 506.

In some embodiments, the conductive elements 504 b and 504 c are used asshielding elements. In some embodiments, the conductive elements 504 bor 504 c are electrically isolated from the conductive element 504 a.The conductive element (shielding element) 504 b or 504 c may be used toprevent undesired interaction between the antenna elements 538 a and thesemiconductor die 510A or 510B.

Many variations and/or modifications can be made to embodiments of thedisclosure. In some other embodiments, one of the conductive elements504 b and 504 c is not used as a shielding element and is electricallyconnected to one of the antenna elements through another conductivefeature (not shown in FIG. 5I) formed in the protective layer 528.

In some embodiments, the antenna element 538 a is used to receive ortransmit electromagnetic signals that have a wavelength. In someembodiments, the protective layer 528 has a thickness that is in a rangefrom about 0.01 times the wavelength to about 0.25 times the wavelength.

As shown in FIG. 5J, a passivation layer 540 is formed over thestructure shown in FIG. 5I to protect the antenna elements, inaccordance with some embodiments. The material and formation method ofthe passivation layer 540 may be similar to or the same as those of thepassivation layer 102.

In some embodiments, a dicing operation is performed to obtain multiplechip packages. Afterwards, the tape frame 526 is removed, as shown inFIG. 5J in accordance with some embodiments. One of the chip packages isshown.

In the embodiments illustrated in FIGS. 5A-5J, the formation of theantenna elements involves a conductive paste printing process. However,many variations and/or modifications can be made to embodiments of thedisclosure. In some other embodiments, the antenna elements are formedusing a process other than the conductive paste printing process.

FIGS. 6A-6E are cross-sectional views of various stages of a process forforming a chip package, in accordance with some embodiments. As shown inFIG. 6A, a structure similar to the structure shown in FIG. 5G isprovided or received. Afterwards, a seed layer 602 is deposited over theprotective layer 528, as shown in FIG. 6A in accordance with someembodiments. In some embodiments, the seed layer 602 is made of orincludes copper, titanium, gold, cobalt, another suitable material, or acombination thereof. In some embodiments, the seed layer is depositedusing a PVD process (such as a sputtering process), a CVD process,another applicable process, or a combination thereof.

As shown in FIG. 6B, a mask layer 604 is formed over the seed layer 602,in accordance with some embodiments. The mask layer 604 has openingsthat define patterns of antenna elements that will be formed later. Insome embodiments, the mask layer 604 is a patterned photoresist layer.In some embodiments, the patterns are similar to those shown in FIG. 9.

As shown in FIG. 6C, conductive layers including a conductive layer 606is deposited on the seed layer 602, in accordance with some embodiments.These conductive layers form multiple antenna elements and conductivefeatures. For example, the portion of the conductive layer 606 thatfills one of the openings 530 forms a conductive feature 606 b. Theportion of the conductive layer 606 over the protective layer 528 formsan antenna element 606 a. In some embodiments, the antenna element 606 ais electrically connected to the conductive element 512 of thesemiconductor die 510A through the conductive feature 606 b, theconductive element 504 a, and the conductive feature 506.

The conductive layer 606 may be made of or include copper, cobalt, gold,another suitable material, or a combination thereof. In someembodiments, the conductive layer 606 is deposited using anelectroplating process, an electroless plating process, anotherapplicable process, or a combination thereof. In some other embodiments,the conductive layer 606 is deposited using a PVD process, a CVDprocess, a plating process, anther applicable process, or a combinationthereof.

As shown in FIG. 6D, the mask layer 604 is removed, in accordance withsome embodiments. A portion of the seed layer 602 is exposed after theremoval of the mask layer 604. Afterwards, the exposed portion of theseed layer 602 is removed. An etching process may be used to remove theexposed portion of the seed layer 602.

As shown in FIG. 6E, a passivation layer 608 is formed over thestructure shown in FIG. 6D to protect the antenna elements including theantenna element 606 a, in accordance with some embodiments. The materialand formation method of the passivation layer 608 may be similar to orthe same as those of the passivation layer 102.

In some embodiments, a dicing operation is performed to obtain multiplechip packages. Afterwards, the tape frame 526 is removed, as shown inFIG. 6E in accordance with some embodiments. One of the chip packages isshown.

Many variations and/or modifications can be made to embodiments of thedisclosure. FIGS. 7A-7D are cross-sectional views of various stages of aprocess for forming a chip package, in accordance with some embodiments.

As shown in FIG. 7A, a structure similar to the structure shown in FIG.5G is provided or received. Afterwards, a conductive pin 704 isinstalled into the opening 530, as shown in FIG. 7A in accordance withsome embodiments. In some embodiments, the conductive pin 704 has acolumn portion and a base portion. The base portion may be wider thanthe column portion. In some embodiments, the conductive pin 704 is madeof or includes copper, aluminum, gold, titanium, platinum, cobalt,another suitable material, or a combination thereof. In someembodiments, a solder layer 702 is used to affix the conductive pin 704on the conductive element 504 a.

As shown in FIG. 7B, a mask 706 (or a stencil) is placed over thestructure shown in FIG. 7A, in accordance with some embodiments. Themask 706 has openings that are used to define patterns of antennaelements that will be formed later. In some embodiments, the patternsare similar to the patterns shown in FIG. 9.

Afterwards, a squeegee 710 is used to move a conductive paste material708 into the openings of the mask 706, as shown in FIG. 7B in accordancewith some embodiments. In some embodiments, the conductive pastematerial 708 includes a copper-containing paste material, agold-containing paste material, another suitable material, or acombination thereof.

As shown in FIG. 7C, a reflow process is performed on the conductivepaste material 708, in accordance with some embodiments. As a result,the conductive paste material 708 turns into conductive layers includinga conductive layer 712 that fills the openings 530. These conductivelayers form multiple antenna elements and conductive features. In someembodiments, the operation temperature of the reflow process is in arange from about 180 degrees C. to about 250 degrees C. In someembodiments, the operation time of the reflow process is in a range from30 minutes to about 2 hours.

The portion of the conductive layer 712 that fills one of the openings530 forms a conductive feature 712 b. The portion of the conductivelayer 712 over the protective layer 528 forms an antenna element 712 a.In some embodiments, the antenna element 712 a is electrically connectedto the semiconductor die 510A through the conductive feature 712 b andthe conductive pin 704.

As shown in FIG. 7D, a passivation layer 714 is formed over thestructure shown in FIG. 7C to protect the antenna elements including theantenna element 712 a, in accordance with some embodiments. The materialand formation method of the passivation layer 714 may be similar to orthe same as those of the passivation layer 102.

In some embodiments, a dicing operation is performed to obtain multiplechip packages. Afterwards, the tape frame 526 is removed, as shown inFIG. 7D in accordance with some embodiments. One of the chip packages isshown.

Many variations and/or modifications can be made to embodiments of thedisclosure. FIGS. 8A-8C are cross-sectional views of various stages of aprocess for forming a chip package, in accordance with some embodiments.

As shown in FIG. 8A, a structure similar to the structure shown in FIG.7A is provided or received. Afterwards, a seed layer 802 is depositedover the protective layer 528, as shown in FIG. 8A in accordance withsome embodiments. In some embodiments, the seed layer 802 conformallyextends along sidewalls of the opening 530 and sidewalls of theconductive pin 704. The material and formation method of the seed layermay be similar to or the same as those of the seed layer 602.

As shown in FIG. 8B, a mask layer 804 is formed over the seed layer 802,in accordance with some embodiments. The mask layer 604 has openingsthat define patterns of antenna elements that will be formed later. Insome embodiments, the mask layer 804 is a patterned photoresist layer.In some embodiments, the patterns are similar to those shown in FIG. 9.

As shown in FIG. 8C, conductive layers including a conductive layer 806is deposited on the seed layer 802, in accordance with some embodiments.These conductive layers form multiple antenna elements and conductivefeatures. For example, the portion of the conductive layer 806 thatfills one of the openings 530 forms a conductive feature 806 b. Theportion of the conductive layer 806 over the protective layer 528 formsan antenna element 806 a. In some embodiments, the antenna element 806 ais electrically connected to the semiconductor die 510A through theconductive feature 806 b and the conductive pin 704. The material andformation method of the conductive layer 806 may be similar to or thesame as those of the conductive layer 606.

As shown in FIG. 8C, the mask layer 804 is removed, in accordance withsome embodiments. A portion of the seed layer 802 is exposed after theremoval of the mask layer 804. Afterwards, the exposed portion of theseed layer 802 is removed. An etching process may be used to remove theexposed portion of the seed layer 802.

As shown in FIG. 8C, a passivation layer 808 is formed over the seedlayer 802 and the conductive layer 806, in accordance with someembodiments. The material and formation method of the passivation layer808 may be similar to or the same as those of the passivation layer 102.

In some embodiments, a dicing operation is performed to obtain multiplechip packages. Afterwards, the tape frame 526 is removed, as shown inFIG. 8C in accordance with some embodiments. One of the chip packages isshown.

Embodiments of the disclosure form a chip package with antenna elements.An integrated fan-out (InFO) chip package is integrated with aprotective layer with the antenna elements formed thereon. The antennaelements and the protective layer are stacked on the InFO chip packageother than laterally disposed beside a semiconductor die in the chippackage. One or more conductive features (such as vertical conductivefeatures penetrating through the protective layer) are used to establishelectrical connection between the semiconductor die in the InFO chippackage and the antenna elements formed on the protective layer.Therefore, the electrical connections between the semiconductor die andthe antenna elements may occupy a relatively small area. The size of thechip package may be reduced further. The antenna elements of the chippackage may perform better.

In accordance with some embodiments, a chip package is provided. Thechip package includes a semiconductor die having a conductive elementand a first protective layer surrounding the semiconductor die. The chippackage also includes a second protective layer over the semiconductordie and the first protective layer. The chip package further includes anantenna element over the second protective layer. The antenna element iselectrically connected to the conductive element of the semiconductordie.

In accordance with some embodiments, a method for forming a chip packageis provided. The method includes forming an antenna element over asupport substrate and forming a first protective layer over the supportsubstrate and the antenna element. The method also includes disposing asemiconductor die over the first protective layer. The method furtherincludes forming a second protective layer over the first protectivelayer to surround the semiconductor die. In addition, the methodincludes forming electrical connection between a conductive element ofthe semiconductor die and the antenna element.

In accordance with some embodiments, a method for forming a chip packageis provided. The method includes forming a first conductive feature overa support substrate and disposing a semiconductor die over the supportsubstrate. The method also includes forming a first protective layerover the support substrate to surround the semiconductor die and thefirst conductive feature. The method further includes replacing thesupport substrate with a second protective layer and forming an antennaelement over the second protective layer. In addition, the methodincludes forming electrical connection between a conductive element ofthe semiconductor die and the antenna element.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

1-15. (canceled)
 16. A method for forming a chip package, comprising:forming a first conductive feature over a support substrate; disposing asemiconductor die over the support substrate; forming a first protectivelayer over the support substrate to surround the semiconductor die andthe first conductive feature; replacing the support substrate with asecond protective layer; forming an antenna element over the secondprotective layer; and forming electrical connection between a conductiveelement of the semiconductor die and the antenna element.
 17. The methodfor forming a chip package as claimed in claim 16, further comprising:forming an opening in the second protective layer; and forming a secondconductive feature in the opening to be electrically connected to thefirst conductive feature, wherein the second conductive feature iselectrically connected to the antenna element, and is electricallyconnected to the conductive element of the semiconductor die through thefirst conductive feature.
 18. The method for forming a chip package asclaimed in claim 16, further comprising: forming an opening in thesecond protective layer; printing a conductive paste over the secondprotective layer to fill the opening; and curing the conductive paste toform a conductive layer, wherein the conductive layer has a firstportion over the second protective layer and a second portion fillingthe opening, the first portion forms the antenna element, and the secondportion forms a second conductive feature.
 19. The method for forming achip package as claimed in claim 18, further comprising installing aconductive pin in the opening before printing the conductive paste. 20.The method for forming a chip package as claimed in claim 19, furthercomprising forming a seed layer on the conductive pin before printingthe conductive paste.
 21. The method for forming a chip package asclaimed in claim 19, wherein the conductive pin has a lower portion andan upper portion, the lower portion is between the upper portion and thefirst protective layer, and the lower portion is wider than the upperportion.
 22. The method for forming a chip package as claimed in claim16, further comprising: forming an opening in the second protectivelayer; and forming a conductive layer over the first protective layer,wherein the conductive layer has a first portion over the secondprotective layer and a second portion extending into the opening, thefirst portion forms the antenna element, and the second portion forms asecond conductive feature.
 23. The method for forming a chip package asclaimed in claim 22, wherein the conductive layer is formed using anelectroplating process, an electroless plating process, or a combinationthereof.
 24. The method for forming a chip package as claimed in claim16, further comprising: disposing a second semiconductor die over thesupport substrate before the first protective layer is formed, whereinafter the first protective layer is formed, the first protective layersurrounds the second semiconductor die.
 25. The method for forming achip package as claimed in claim 16, wherein the second protective layerhas a lower dielectric constant than that of the first protective layer.26. The method for forming a chip package as claimed in claim 16,wherein the second protective layer has a lower dissipation factor thanthat of the first protective layer.
 27. The method for forming a chippackage as claimed in claim 16, further comprising forming a shieldingelement over the support substrate before the semiconductor die isdisposed, wherein the semiconductor die covers a portion of theshielding element after the semiconductor die is disposed.
 28. Themethod for forming a chip package as claimed in claim 27, wherein theshielding element is electrically isolated from the shielding element.29. A method for forming a chip package, comprising: disposing asemiconductor die over a support substrate; forming a first protectivelayer over the support substrate to surround the semiconductor die;removing the support substrate; forming a second protective layer overthe first protective layer; forming an antenna element over the secondprotective layer; and forming electrical connection between a conductiveelement of the semiconductor die and the antenna element.
 30. The methodfor forming a chip package as claimed in claim 29, further comprising:forming an opening in the second protective layer; and forming a secondconductive feature in the opening to be electrically connected to thefirst conductive feature, wherein the second conductive feature iselectrically connected to the antenna element, and is electricallyconnected to the conductive element of the semiconductor die.
 31. Themethod for forming a chip package as claimed in claim 29, furthercomprising: forming an opening in the second protective layer; printinga conductive paste over the second protective layer to fill the opening;and curing the conductive paste to form a conductive layer, wherein theconductive layer has a first portion over the second protective layerand a second portion filling the opening, the first portion forms theantenna element, and the second portion electrically connects theantenna element and the conductive element of the semiconductor die. 32.The method for forming a chip package as claimed in claim 31, furthercomprising installing a conductive pin in the opening before printingthe conductive paste.
 33. The method for forming a chip package asclaimed in claim 31, wherein the conductive pin has a lower portion andan upper portion, the lower portion is between the upper portion and thefirst protective layer, and the lower portion is wider than the upperportion.
 34. A method for forming a chip package, comprising: forming afirst protective layer to surround a semiconductor die; forming a secondprotective layer over the first protective layer; forming an antennaelement over the second protective layer, wherein the second protectivelayer is between the antenna element and the semiconductor die; andforming electrical connection between a conductive element of thesemiconductor die and the antenna element.
 35. The method for formingthe chip package as claimed in claim 34, further comprising: forming anopening in the second protective layer; and forming a conductive layerover the second protective layer, wherein a first portion of theconductive layer extends into the opening, and a second portion of theconductive layer forms the antenna element.